10 PCS/Pack 2UUL DW15 2015 Ultra Density Solder Vampire Desoldering Wick

1. Single roll specifications: 2.0mm wide, 1.5m long; bulk packaging for repairs, meeting daily desoldering needs.
2. Ultra-high density woven copper mesh, excellent thermal conductivity, significantly improving desoldering efficiency.
3. Quickly removes excess solder, leaving pads clean and residue-free, effectively protecting PCB pads during chip replacement.
4. Anti-fragmentation design at the head prevents the desoldering tape from unraveling, facilitating alignment with tiny solder joints, suitable for precision micro-soldering on motherboards.
5. High-quality copper braided material, formulated with flux for smooth thermal conductivity.
6. For repairing mobile phone motherboards, PCB circuit boards, and IC chips.